Blog review March 9, 2015
Pete Singer is delighted to announce the keynotes and other speakers for The ConFab 2015, to be held May 19-22 at The Encore at The Wynn in Las Vegas. The line-up includes Ali Sebt, President and CEO...
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Optimism Reigns at SPIE Lithography Conference, Despite Challenges
By Jeff Dorsch, Contributing Editor Semiconductor manufacturing and design is growing increasingly complicated and just plain hard. Everyone knows that. The bad news is it’s only going to get worse....
View ArticleCanon, Toshiba Join eBeam Initiative Group
By Jeff Dorsch, Contributing Editor The eBeam Initiative announced that Canon and Toshiba are new members of the industry organization, which seeks to promote the use of electron-beam technology in...
View ArticleLaser Suppliers Move Past the Neon Gas Crisis
By Jeff Dorsch, Contributing Editor That neon gas shortage? So 2015. The supply issue continues, as armed conflict heats up in eastern Ukraine, site of a plant that supplies a majority of the neon gas...
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ASML Details Advances in DUV, Metrology, EUV
By Jeff Dorsch, Contributing Editor ASML Holding is glad to talk about its continuing progress in extreme-ultraviolet lithography technology. But first, the company has some information about its...
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Many Mixes to Match Litho Apps
By Ed Korczynski, Sr. Technical Editor “Mix and Match” has long been a mantra for lithographers in the deep-sub-wavelength era of IC device manufacturing. In general, forming patterns with resolution...
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EUV Resists and Stochastic Processes
By Ed Korczynski, Sr. Technical Editor In an exclusive interview with Solid State Technology during SPIE-AL this year, imec Advanced Patterning Department Director Greg McIntyre said, “The big...
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High-NA EUV Lithography Investment
By Ed Korczynski, Sr. Technical Editor As covered in a recent press release, leading lithography OEM ASML invested EUR 1 billion in cash to buy 24.9% of ZEISS subsidiary Carl Zeiss SMT, and committed...
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Lithographic Stochastic Limits on Resolution
By Ed Korczynski, Sr. Technical Editor The physical and economic limits of Moore’s Law are being approached as the commercial IC fab industry continues reducing device features to the atomic-scale....
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EUVL Materials Readiness for HVM
By Ed Korczynski, Sr. Technology Editor Extreme-Ultra-Violet Lithography (EUVL)—based on ~13.5nm wavelength EM waves bouncing off mirrors in a vacuum—will finally be used in commercial IC fabrication...
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